1. 2. 3. material content data sheet sales product name ice3br0665jz issued 29. august 2013 ma# MA001029930 package pg-dip-7-3 weight* 645.54 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.709 0.88 0.88 8843 8843 leadframe inorganic material phosphorus 7723-14-0 0.048 0.01 75 non noble metal zinc 7440-66-6 0.194 0.03 300 non noble metal iron 7439-89-6 3.872 0.60 5998 non noble metal copper 7440-50-8 157.218 24.35 24.99 243545 249918 wire noble metal gold 7440-57-5 0.421 0.07 0.07 652 652 encapsulation organic material carbon black 1333-86-4 2.339 0.36 3623 plastics epoxy resin - 63.152 9.78 97828 inorganic material silicondioxide 60676-86-0 402.302 62.32 72.46 623203 724654 leadfinish non noble metal tin 7440-31-5 6.460 1.00 1.00 10006 10006 plating noble metal silver 7440-22-4 1.594 0.25 0.25 2469 2469 glue plastics epoxy resin - 0.391 0.06 605 noble metal silver 7440-22-4 1.842 0.29 0.35 2853 3458 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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